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ASMT-QWB2-Nxxxx
Super 0.5W White Power PLCC-4 Surface Mount LED Indicator
Data Sheet
Description
The Super 0.5W White Power PLCC-4 SMT LED is first white mid-Power PLCC-4 SMT LEDs using InGaN chip technology. The package can be driven at high current due to its superior package design.The product is able to dissipate the heat more efficiently compared to the PowerPLCC-4SMTLEDs.TheseLEDsproducehigherlight output with better flux performance compared to the PowerPLCC-4SMTLED. The Super 0.5W White Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operateunderawiderangeofenvironmentalconditions. Theperformancecharacteristicsofthesenewmid-power LEDsmakethemuniquelysuitableforuseinharshconditionssuchasinautomotiveapplications,andinelectronicssignsandsignals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shippedinsingleintensityandcolorbin,toprovideclose uniformity.TheseLEDsarecompatiblewiththeIRsolder reflowprocess.Duetothehighreliabilityfeatureofthese products, they also can be mounted using through-thewavesolderingprocess.
Features
* IndustryStandardPLCC4platform(3.2x2.8x1.9mm) * HighreliabilityLEDpackageduetoenhancedsilicone resinmaterial * Mid-Powerintensitybrightnesswithoptimumflux performanceusingInGaNchiptechnologies * AvailableinCoolWhite * Highopticalefficiency30lm/W * Availablein8mmcarriertapeand7inchreel * LowThermalResistance60C/W * Superwideviewingangleat120 * JEDECMSL2a
Applications
1. Interiorautomotive a. Instrumentpanelbacklighting b. Centralconsolebacklighting c. Navigationandaudiosystembacklighting d. Dome/Maplighting e. Pushbuttonbacklighting f. Puddlelamp g. Glovecompartmentillumination 2. Exteriorautomotive a. Numberplateillumination b. Rearreverselampindicator 3. Electronicsignsandsignals a. Decorativelighting 4. Officeautomation,homeappliances,industrial equipment a. Panel/buttonbacklighting b. Displaybacklighting
CAUTION: ASMT-QWB2-Nxxxx LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Drawing
Note: 1. AllDimensionsinmillimeters. 2. LeadPolarityasshowninFigure11. 3. TerminalFinish:Agplating 4. Encapsulationmaterial:Siliconeresin
Figure 1. Package Drawing
Table 1. Device Selection Guide
Luminous Flux, FV [1] (lm) Color White Part Number Min. Flux (lm) Typ. Flux (lm) 7.0 Max. Flux (lm) 9.5 Test Current (mA) 50 Dice Technology InGaN ASMT-QWB-NEF0E .5
Notes: 1. FVisthetotalluminousfluxoutputasmeasuredwithanintegratingsphereatmonopulseconditions. 2. Tolerance=12%
Part Numbering System
A S M T - Q X1 B 2 - N X2 X3 X4 X5 Packaging Option Colour Bin Selection Max. Flux Bin Min. Flux Bin LED Chip Color
Table 2. Absolute Maximum Ratings (TA = 25 C)
Parameters DC Forward Current [] Peak Forward Current [] Power Dissipation Reverse Voltage Junction Temperature Operating Temperature Storage Temperature ASMT-QWB2-Nxxxx 50 mA 00 mA 5 mW Not Recommended for Reverse Bias 5 C -40 C to +0 C -40 C to +0 C
Notes: 1. DerateLinearlyasshowninFigure6. 2. DutyFactor=10%,Frequency=1kHz
Table 3. Optical Characteristics (TA = 25 C)
Typical Chromaticity Coordinates[1] x 0. y 0. Viewing Angle 2l1/2[2] (Degrees) Typ. 0 Luminous Efficacy hV[3] (lm/W) Typ. 89 Luminous Efficiency he (lm/W) Typ. 0 Luminous Intensity / Total Flux IV (cd) / fV (lm) Typ. 0.5
Color White
Part Number
Dice Technology
ASMT-QWB-Nxxxx InGaN
Notes: 1. Thedominantwavelength,lD,isderivedfromtheCIEChromaticitydiagramandrepresentsthecolorofthedevice. 2. q1/2istheoff-axisanglewheretheluminousintensityis1/2thepeakintensity. 3. Radiantintensity,Ieinwatts/steradian,maybecalculatedfromtheequationIe=IV/hV,whereIVistheluminousintensityincandelasandhVis theluminousefficacyinlumens/watt. 4. Visthetotalluminousfluxoutputasmeasuredwithanintegratingsphereafterthedevicehasstabilized. 5. Fluxtestedatmonopulseconditions.
Table 4. Electrical Characteristics (TA = 25 C)
Forward Voltage VF (Volts) @ IF = 150 mA Part Number ASMT-QWB-Nxxxx
1.0 0.9 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 400 420 440 460 480 500 520 540 560 580 600 620 640 660 680 700 720 740 760 780 0.8
Typ. .6
Max. 4.
Thermal Resistance RqJ-P (C/W) 60
350 300
FORWARD CURRENT - mA
RELATIVE INTENSITY
250 200 150 100 50 0 0 1 2 3 4 FORWARD VOLTAGE - V 5
WAVELENGTH - nm
Figure 2. Relative Intensity Vs. Wavelength
Figure 3. Forward Current Vs. Forward Voltage.
1.2 1 RELATIVE LUMINOUS FLUX (NORMALIZATION AT 150mA) 0.8 0.6 0.4 0.2 0
1.4 1.2 NORMALIZED LUMINOUS INTENSITY 1 0.8 0.6 0.4 0.2 0 0 25 50 75 100 DC FORWARD CURRENT - mA 125 150 -50 -25 0 25 50 75 100 125 JUNCTION TEMPERATURE - C
Figure 4. Relative Flux vs. Forward Current
160 140 MAXIMUM FORWARD CURRENT - mA
Figure 5. Relative Intensity Vs. Temperature
160 140 MAXIMUM FORWARD CURRENT - mA
120 100 80 60 40 20 0
R JA = 90C/W R JA = 110C/W
120 100 80 60 40 20 0 R JP = 60C/W
0
20
40 60 80 AMBIENT TEMPERATURE - C
100
120
0
20
40 60 80 SOLDER POINT TEMPERATURE - C
100
120
Figure 6a. Maximum Forward Current Vs. Ambient Temperature. Derated Based on TJMAX = 125C, RqJ-A = 90C/W and 110 C/W.
0.25 0.2
FORWARD VOLTAGE SHIFT - V
Figure 6b. Maximum forward current vs. solder point temperature. Derated Based on TJMAX = 125C, RqJP=60C/W
1 0.9 0.8 NORMALIZED INTENSITY 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 90
0.15 0.1 0.05 -50 -25 0 -0.05 -0.1 -0.15 JUNCTION TEMPERATURE - C 0 25 50 75 100
ANGULAR DISPLACEMENT - DEGREES
Figure 7. Forward Voltage Shift Vs. Temperature.
Figure 8. Radiation Pattern
4
D
Figure 10. Recommended Pb-free Reflow Soldering Profile.
Note: Diameter "D" should be smaller than 2.2mm Note:FordetailinformationonreflowsolderingofAvagosurfacemount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMTLEDIndicatorComponents
Figure 9. Recommended Pick and Place Nozzle Size
Figure 11. Recommended Soldering Pad Pattern.
5
Figure 12. Tape Leader and Trailer Dimensions.
Figure 13. Tape Dimensions.
Figure 14. Reeling Orientation.
6
This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface MountDevicesfordetails.
Device Color (X1)
W White
Flux Bin Select (X2X3)
Individualreelwillcontainpartsfromonebinonly X X Min Flux Bin Max Flux Bin
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf lifehasexceeded12monthsandtheHICindicates thatbakingisnotrequired,thenitissafetoreflow theLEDspertheoriginalMSLrating. - It is not recommended to open the MBB prior to assembly(e.g.forIQC).
Flux Bin Limits
Bin ID A B C D E F G H I J K Min. (lm) 4.0 5.50 7.00 9.00 .50 5.00 9.50 5.50 .00 4.00 56.00 Max. (lm) 5.50 7.00 9.00 .50 5.00 9.50 5.50 .00 4.00 56.00 7.00
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read immediatelyuponopeningofMBB. - TheLEDsmustbekeptat<30C/60%RHatalltime andallhightemperaturerelatedprocessincluding soldering, curing or rework need to be completed within672hours.
C. Control for unfinished reel
- For any unuse LEDs, they need to be stored in sealedMBBwithdesiccantordesiccatorat<5%RH.
D. Control of assembled boards
- IfthePCBsolderedwiththeLEDsistobesubjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceededtheirfloorlifeof672hours.
Toleranceofeachbinlimit=12%
Color Bin Select (X4)
Individualreelwillcontainpartsfromonefullbinonly. 0 A B C D E G H J K M N P R S Z Full Distribution and only and only and 4 only 4 and 5 only 5 and 6 only , and only , and 4 only , 4 and 5 only 4, 5 and 6 only , , and 4 only , , 4 and 5 only , 4, 5 and 6 only , , , 4 and 5 only , , 4, 5 and 6 only Special Color Bin
E. Baking is required if:
- "10%"or"15%"HICindicatorturnspink. - TheLEDsareexposedtoconditionof>30C/60% RHatanytime. - TheLEDsfloorlifeexceeded672hours. Recommendedbakingcondition:605Cfor20hours.
7
Color Bin Limits
Bin ID 4 5 6 7 8 x y x y x y x y x y x y x y x y 0.96 0.59 0.9 0.68 0. 0.84 0.0 0.97 0.0 0.0 0.0 0.0 0.5 0.44 0.45 0.5 Limits (Chromaticity Coordinates) 0.9 0.68 0.85 0.79 0.0 0.97 0.07 0. 0.0 0.0 0.0 0.47 0.8 0.4 0.47 0.7 0.0 0.97 0.07 0. 0.0 0.0 0.0 0.47 0.8 0.4 0.47 0.7 0.64 0.80 0.67 0.40 0. 0.84 0.0 0.97 0.0 0.0 0.0 0.0 0.5 0.44 0.45 0.5 0.60 0.57 0.64 0.80
VF Bin Limits
Bin ID S5 S6 S7 Min. .0 .50 .80 Max. .50 .80 4.0
Toleranceofeachbinlimit=0.1V
Packaging Option (X5)
Option E Test Current 50mA Package Type Top Mount Reel Size 7 Inch
Toleranceofeachbinlimit=0.02.
Y - COORDINATE
X - COORDINATE
Handling Precaution
Theencapsulationmaterialoftheproductismadeofsiliconeforbetterreliabilityoftheproduct.Assiliconeisasoft material,pleasedonotpressonthesiliconeorpokeasharpobjectontothesilicone.Thesemightdamagetheproduct andcauseprematurefailure.Duringassemblyofhandling,theunitshouldbeheldonthebodyonly.Pleasereferto AvagoApplicationNoteAN5288fordetailinformation.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 007 Avago Technologies Limited. All rights reserved. AV0-009EN - July , 007

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